One-packed (in readiness for use) structural adhesive sealant is characterized by high strength characteristies at temperatures up to 250 ^oС, good heat-resistance and adhesion to materials used in microelectronics.

Cured adhesive is characterized by:

• high strength characteristics at temperatures up to 250^oС;
• good heat-resistance;
• sealing of adhesive joint;
• resistance to cyclic loads, thermocycling and other.