Application of glues-solutions in microelectronics and the electrical engineer 

Good atmospherestability, ease in drawing, a fine varnish film, have provided application of glues BFN as sheetings and marks structures by manufacture of various units and blocks in radio equipment, microelectronics, blocks of management, etc.

Ability strongly to stick together various materials, good electroisolation properties provide applicability of glues of series BFN for manufacturing coils without a skeleton and as electroisolation a varnish.

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